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Epoxy Molding Compound

IP.com Disclosure Number: IPCOM000097928D
Original Publication Date: 1961-Oct-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Fisher, DW: AUTHOR

Abstract

Encapsulation of electronic circuit modules is effected with this molding compound. It has excellent physical, chemical and electrical properties, including light weight, exceptional flow, and low temperature, low pressure moldability.

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Epoxy Molding Compound

Encapsulation of electronic circuit modules is effected with this molding compound. It has excellent physical, chemical and electrical properties, including light weight, exceptional flow, and low temperature, low pressure moldability.

An epoxy resin is heated to about 200 degrees F. A montan wax is then added to the epoxy resin and forms a melt with it. A filler material, comprising hollow glass spheres of particle size, is blended with the melt.

The material is cooled to room temperature, and an eutectic mixture of methyl phenylene diamine and isopropyl phenylene diamine is blended with it. The resultant compound is allowed to harden for 16 to 24 hours at room temperature on a wax coated surface. The compound is frozen to make it more brittle and then broken up and mixed with solid carbon dioxide in substantially equal proportions by volume. The material is reduced by grinding to a desired particle size, and is stored under refrigeration.

The proportion of the various materials forming the molding compound are:
1. Epoxy resin (Hysol No. 6040 available from

180 parts by weight

Houghton Laboratories)
2. Hollow glass spheres (30 to 300 microns in

80 parts by weight

particle size)
3. Montan wax (W-6 available from Houghton

3 parts by weight

Laboratories)
4. Eutectic mixture of methyl phenylene diamine

33 parts by weight

and isopropyl phenylene diamine

1