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Capacitor Discharge Packaging

IP.com Disclosure Number: IPCOM000098028D
Original Publication Date: 1961-Dec-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Chapman, RM: AUTHOR

Abstract

The ceramic and foil component packaging parts are brought into contact and bonded together by capacitor discharge bonding. The bond is achieved by locating a component in a central supporting plate 1, adding bonding foil 2 and conductor foil layers 3 and outer ceramic cover plates 4 and 5, and discharging a high potential through them. The potential employed is about 8000 volts discharged through a spark gap switch.

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Capacitor Discharge Packaging

The ceramic and foil component packaging parts are brought into contact and bonded together by capacitor discharge bonding. The bond is achieved by locating a component in a central supporting plate 1, adding bonding foil 2 and conductor foil layers 3 and outer ceramic cover plates 4 and 5, and discharging a high potential through them. The potential employed is about 8000 volts discharged through a spark gap switch.

The process is used to bond a conductor pattern within two ceramic substrates. The foil used is a pre-blanked conductor pattern. Since only a small amount of the metal is vaporized, the bond is achieved and sufficient metal remains for conduction. By this process, a semiconductor device is completely enclosed within a ceramic package. This eliminates the need for capping and also reduces the overall size of the packaged parts.

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