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Browse Prior Art Database

Component Support And Cooling

IP.com Disclosure Number: IPCOM000098104D
Original Publication Date: 1960-Feb-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 93K

Publishing Venue

IBM

Related People

McGregor, JE: AUTHOR

Abstract

Electronic components 1 are rigidly supported and liquid cooled when placed in a liquid tight container 2. Portions of 2, not occupied by components are filled with nylon spheres 3 or a non-ballooning type plastic or ceramic with a high modulus of rigidity. Either method provides for circulation of the coolant while providing rigidity.

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Component Support And Cooling

Electronic components 1 are rigidly supported and liquid cooled when placed in a liquid tight container 2. Portions of 2, not occupied by components are filled with nylon spheres 3 or a non-ballooning type plastic or ceramic with a high modulus of rigidity. Either method provides for circulation of the coolant while providing rigidity.

The liquid may be circulated by an external pump and cooled by an external refrigerator if additional cooling is desired.

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