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Diode Heat Sink

IP.com Disclosure Number: IPCOM000098199D
Original Publication Date: 1960-Apr-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 71K

Publishing Venue

IBM

Related People

Dunkel, WE: AUTHOR

Abstract

Where the silicon material of a diode is soldered directly to a heat sink stud, thermal fatigue produced by repeated on and off conditions often causes separation of the silicon material and stud.

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Diode Heat Sink

Where the silicon material of a diode is soldered directly to a heat sink stud, thermal fatigue produced by repeated on and off conditions often causes separation of the silicon material and stud.

To overcome this condition, a nonrigid mounting is obtained by sandwiching the silicon material between, for example, layers of solder filled copper mesh or screen. These layers are then soldered to the silicon material and the connector and stud, respectively.

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