Browse Prior Art Database

Methods of Connecting Wires to Substrates

IP.com Disclosure Number: IPCOM000098316D
Original Publication Date: 1960-Jul-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 55K

Publishing Venue

IBM

Related People

Koelsch, AC: AUTHOR

Abstract

Solutions of the problem of attaching connecting leads to thin films deposited upon substrates in a vacuum are illustrated in the above figures.

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Methods of Connecting Wires to Substrates

Solutions of the problem of attaching connecting leads to thin films deposited upon substrates in a vacuum are illustrated in the above figures.

Prior to the deposition of the films, the wires are mechanically attached to the substrate as shown, the silver paint being applied to contact the attached wires and a portion of the area on which the thin film is deposited afterwards.

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