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Printed Circuit Card

IP.com Disclosure Number: IPCOM000098326D
Original Publication Date: 1960-Aug-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 61K

Publishing Venue

IBM

Related People

Sterling, JL: AUTHOR

Abstract

A method of forming a printed circuit card consists of the steps of transferring conductive patterns to uncured plastic sheets. The sheets are stacked and plasticized into a unit card.

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Printed Circuit Card

A method of forming a printed circuit card consists of the steps of transferring conductive patterns to uncured plastic sheets. The sheets are stacked and plasticized into a unit card.

Circuit patterns such as 10, 11, 12 and 13 (layer B), entry conductors 14 (layer A), lands 15, 16 (layer C) for connecting between layers B and D, etc., consist of tinned copper which is cut from copper sheets and imbedded in the plastic layers A, B, C, D and E by steel rule dies.

The layers of uncured plastic bearing the copper patterns are stacked in a predetermined order and placed in a heated press. Here the temperature and pressure plasticize the several layers and melt the tinning between the adjoining circuit patterns to interconnect the circuits and form the plastic layers into a unit card.

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