Browse Prior Art Database

Point to point Component Placement

IP.com Disclosure Number: IPCOM000098420D
Original Publication Date: 1960-Oct-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Hazel, HK: AUTHOR

Abstract

Plate 4 is the base plate of an electronic package to which pins 1 are secured. The components are secured to selected ones of pins 1 by wrapping the component lead about the selected pins. The apparatus accomplishes the securing of the component leads to the pins automatically.

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Point to point Component Placement

Plate 4 is the base plate of an electronic package to which pins 1 are secured. The components are secured to selected ones of pins 1 by wrapping the component lead about the selected pins. The apparatus accomplishes the securing of the component leads to the pins automatically.

Plate 4 is raised first. Component 3 is placed in holder 9 with component leads 2 secured in the jaws of the holder. Holder 9 is then moved longitudinally and rotated so that leads 2 are adjacent to the position of the pins about which they are to be wrapped. Lead former devices 5 and 6 are then moved in a single plane until leads 2 are interposed between fixed pin 8 and spring loaded pin 7 on lead former devices 5 and 6.

Plate 4 is then lowered until the pins are adjacent to leads 2 about which the leads are to be wrapped and component 3 is at the specified level from plate 4. Pins 1, about which the component lead is to be wrapped, push spring loaded pin 7 into the lead former during the downward motion of plate 4. Pin 7 of lead former 6 is not shown depressed. Cams 10 and 11 are then rotated in the direction indicated, rotating pins 8 about pins 1 wrapping the leads 2 about the pins 1. After the wire wrapping has been accomplished and the component secured, base plate 4 is raised with the component leads wrapped about the proper pins. After the desired number of components have been secured to their proper pins the electronic package is removed to dip...