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Through Hole Plating

IP.com Disclosure Number: IPCOM000098422D
Original Publication Date: 1960-Oct-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Radovsky, DA: AUTHOR [+2]

Abstract

A method is provided for electroplating a conductive metal coating on a non-conductive base, for example, by through-hole plating.

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Through Hole Plating

A method is provided for electroplating a conductive metal coating on a non- conductive base, for example, by through-hole plating.

The surface 10 to be plated is coated with a thin film 11 of metal particles from liquid suspension directly on the dielectric base 12. These particles are minute and of semi-colloidal size. Metals suitable for this purpose are those which can be formed in liquid suspension as colloids or semi-colloids such as palladium, copper, gold, silver, platinum, nickel, cobalt, and iron.

After the film has been placed on the dielectric base 10, electro plating is effected. Because of the high resistivity of the film 11, the electroplating is started at a conventional conductor such as foil film 13 and builds up as a film 14 directly on the film 11.

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