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Electrodeposition Of Co-Ni Alloys From An Electrolyte Containing Sulphur Additives

IP.com Disclosure Number: IPCOM000098446D
Original Publication Date: 1960-Oct-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Koretzky, H: AUTHOR

Abstract

The plating bath is for electrodepositing Co-Ni alloys having high coercive forces, a relatively high squareness ratio and a high remanence value. The bath comprises nickel sulfate hexahydrate (1M), cobalt chloride hexahydrate (1M), and boric acid (0.4M).

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Electrodeposition Of Co-Ni Alloys From An Electrolyte Containing Sulphur Additives

The plating bath is for electrodepositing Co-Ni alloys having high coercive forces, a relatively high squareness ratio and a high remanence value. The bath comprises nickel sulfate hexahydrate (1M), cobalt chloride hexahydrate (1M), and boric acid (0.4M).

The plating conditions are the following: Temperature - 60 degrees, pH= 4.0, Current Density - 100 amps. per sq. ft. D.C. with a superimposed A.C. of 300 asf. The addition of additives in this bath in a concentration range of about 0. 01 g/l (with the exception of saccharin which requires at least 1 g/l) produces films having coercive forces of 220 oersteds, a Br value of 10, 000 gauss and a Br/Bs ratio of 0.65.

The addition agents include ferric thiocyanate, cuprous thiocyanate, sodium thiosulfate, cysteine hydrochloride, saccharin, Reinecke salt, thiomalic acid, thiourea, benzene sulfinic acid, sodium formaldehyde sulfoxylate, thiosemticarbizide, sodium hydrosulfite, ammonium polysulfide, sodium metabisulfite and dimethyl sulfoxide.

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