Browse Prior Art Database

Circuit Board With Component Standoff

IP.com Disclosure Number: IPCOM000098458D
Original Publication Date: 1960-Nov-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Schulz, PR: AUTHOR

Abstract

Component standoffs are provided on a circuit board by applying a heated, forming stylus under pressure.

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Circuit Board With Component Standoff

Component standoffs are provided on a circuit board by applying a heated, forming stylus under pressure.

The stylus 10 has one or more projecting, forming elements 11 which, when heated and applied under pressure to the surface 12, form pairs of projections
13. in addition, the stylus has tapered projections 14 corresponding to lead receiving apertures in board 15 so that the projections 14 taper the apertures to facilitate insertion of component leads 16.

When a load is placed on the projections 13 by the base 17 of a component 18, the projections 13 are forced into abutting relationship and jointly support the component.

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