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Circuit Package

IP.com Disclosure Number: IPCOM000098548D
Original Publication Date: 1959-Feb-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Young, WM: AUTHOR [+3]

Abstract

There is shown an isometric view of a pluggable unit package containing electronic components. Circuit components 3 (lower cut-away section) are assembled in layers between the circuit pins 1 by connecting the component leads 2 to the circuit pins. Following wiring of the components the bottom half of the assembly is potted by a suitable compound 7. A plurality of diodes 4 (center cut-away section) is connected to circuit pins 1 above the potted material 7 and below heat sink 5, which employs thermally conductive material such as copper, and is attached to circuit pins 1 over the layer of diodes. Transistors 6 are clipped on heat sink 5 and their leads are connected to the proper circuit pins 1. The heat sink protects transistors 6 from the radiated heat of components 3 in the potted part of assembly 7.

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Circuit Package

There is shown an isometric view of a pluggable unit package containing electronic components. Circuit components 3 (lower cut-away section) are assembled in layers between the circuit pins 1 by connecting the component leads 2 to the circuit pins. Following wiring of the components the bottom half of the assembly is potted by a suitable compound 7. A plurality of diodes 4 (center cut-away section) is connected to circuit pins 1 above the potted material 7 and below heat sink 5, which employs thermally conductive material such as copper, and is attached to circuit pins 1 over the layer of diodes. Transistors 6 are clipped on heat sink 5 and their leads are connected to the proper circuit pins 1. The heat sink protects transistors 6 from the radiated heat of components 3 in the potted part of assembly 7.

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