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Molded Printed Circuit Through Hole Connection

IP.com Disclosure Number: IPCOM000098574D
Original Publication Date: 1959-Apr-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 60K

Publishing Venue

IBM

Related People

Kollmeier, X: AUTHOR

Abstract

In a method for molding through-hole connections in a printed circuit panel, the operation commences by placing a sandwich of a plastic insulating board 1 with foils 2 and 4 on each side thereof in a molding press 3. This presses the sandwich until the outer foil layers 2 and 4 are in contact with each other. The operation deforms the plastic inner layer 1 of the sandwich and this deformed plastic portion 5 is then removed.

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Molded Printed Circuit Through Hole Connection

In a method for molding through-hole connections in a printed circuit panel, the operation commences by placing a sandwich of a plastic insulating board 1 with foils 2 and 4 on each side thereof in a molding press 3. This presses the sandwich until the outer foil layers 2 and 4 are in contact with each other. The operation deforms the plastic inner layer 1 of the sandwich and this deformed plastic portion 5 is then removed.

Outer foil 2 is thicker than foil 4 and the through connections are made by pressing the foils between opposed bored bushings 6 and 8, mounted in the upper and lower portion of press 3. The excess plastic material protrudes through the thinner foil 4 into the lower bore of bushing 8. The bore of bushing 6 carries a piercing pin 10 which is then actuated to pierce the thicker foil 2, bend the edges of the pierced foil around the edges of the thinner foil 4 and eject the excess plastic 5. The bending of the thicker foil 2 over the thinner foil 4 secures a good mechanical connection.

A later dip-soldering operation, after circuit component leads have been inserted in the hole, changes this mechanical bond into a permanent connection.

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