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Mechanically Bonded Printed Circuit

IP.com Disclosure Number: IPCOM000098599D
Original Publication Date: 1959-Jun-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Haddad, MM: AUTHOR [+2]

Abstract

This printed circuit process uses a plating method by which conductor lines are plated in a bulging, nodular or dove-tail form for bonding to a molded plastic base. The steps are as follows: 1. A negative pattern of resist 20 is printed on a thin copper foil 21. 2. Plating of the conductor lines 22 is continued beyond the thickness of resist 20 to a nodular dove-tail form. 3. The resist is removed. 4. A plastic base material 23 is molded and keyed onto lines 22 with heat and pressure. 5. The carrier foil 21 is removed by etching or machining.

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Mechanically Bonded Printed Circuit

This printed circuit process uses a plating method by which conductor lines are plated in a bulging, nodular or dove-tail form for bonding to a molded plastic base. The steps are as follows: 1. A negative pattern of resist 20 is printed on a thin

copper foil 21.

2. Plating of the conductor lines 22 is continued beyond the

thickness of resist 20 to a nodular dove-tail form.

3. The resist is removed.

4. A plastic base material 23 is molded and keyed onto lines

22 with heat and pressure.

5. The carrier foil 21 is removed by etching or machining.

Steps 1A-5A show a similar process applied to a carrier 24 of stainless steel which may be stripped off to avoid the etching or machining step of Step 5.

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