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Nozzle for Flow Soldering Machines

IP.com Disclosure Number: IPCOM000098644D
Original Publication Date: 1959-Aug-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Pringle, EW: AUTHOR

Abstract

In the automatic soldering of component leads to printed circuit board conductors, molten solder is pumped by a motor driven impeller from a reservoir up through a nozzle. This forms a wave of molten solder into which each printed circuit board is automatically conveyed. The printed circuit board floats on the crest of the wave during which time the component leads and the conductors on the under side are soldered.

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Nozzle for Flow Soldering Machines

In the automatic soldering of component leads to printed circuit board conductors, molten solder is pumped by a motor driven impeller from a reservoir up through a nozzle. This forms a wave of molten solder into which each printed circuit board is automatically conveyed. The printed circuit board floats on the crest of the wave during which time the component leads and the conductors on the under side are soldered.

The flared out extensions on the nozzle decrease the lead and exit angles between the printed circuit board and the wave of solder to minimize the formation of solder stalactites or icicles at the connections on the boards. The extensions also increase the width of the solder wave to allow faster conveyor speeds.

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