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Preparation of Adherent Thin Magnetic Films by Chemical Reduction

IP.com Disclosure Number: IPCOM000098700D
Original Publication Date: 1959-Oct-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Tsu, I: AUTHOR

Abstract

Chemical reduction methods are utilized in the preparation of thin magnetic films which have improved adhesion to the substrate without requiring the use of a conducting layer between the metal and the substrate. Furthermore, the process does not require the use of a special treatment to produce the adherence.

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Preparation of Adherent Thin Magnetic Films by Chemical Reduction

Chemical reduction methods are utilized in the preparation of thin magnetic films which have improved adhesion to the substrate without requiring the use of a conducting layer between the metal and the substrate. Furthermore, the process does not require the use of a special treatment to produce the adherence.

The process steps are as follows: a substrate 1, such as glass receives as a deposit a discontinuous, or island structure, of a metal 2, such as one which is more electronegative than the magnetic film 3. Thereafter, the Fe--Ni, Ni--Co, etc. film 3 is electrolessly plated thereon (see U.S. Patent 2,532,283). By this technique a very square hysteresis loop (0.98), good adhering, low coercive (4 oersteds) films are produced. Since 2 is discontinuous, it is nonconductive, thus eliminating at once all the problems connected with conducting substrates in magnetic devices of this kind.

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