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Compound For Encapsulating Core Matrices

IP.com Disclosure Number: IPCOM000098705D
Original Publication Date: 1959-Oct-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Haines, RS: AUTHOR

Abstract

The operation of magnetic core memories at high speeds has created a need for efficient cooling means for maintaining the ambient temperature of the memory cores within a proper range. Several cooling methods have been suggested for this purpose. One method that has been tested with some success comprises the encapsulation of the memory cores and associated circuitry in a solid heat conducting medium to provide for conduction of heat from the cores to a heat dissipating surface.

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Compound For Encapsulating Core Matrices

The operation of magnetic core memories at high speeds has created a need for efficient cooling means for maintaining the ambient temperature of the memory cores within a proper range. Several cooling methods have been suggested for this purpose. One method that has been tested with some success comprises the encapsulation of the memory cores and associated circuitry in a solid heat conducting medium to provide for conduction of heat from the cores to a heat dissipating surface.

To be practical, the compound used for encapsulating the memory cores must have good thermal conductivity and a low dielectric constant. It must also support the cores without placing undue strain upon them, and it should be reasonably easy to apply and remove when necessary.

High density (isotactic) polyethylene has the high thermal conductivity and low dielectric constant necessary for a practical potting or encapsulating compound, but suffers the drawback that it strains the memory cores beyond allowable limits when solidified. The high density polyethylene also has a crystalline melting point considerably above that desired for easy application and removal.

An efficient potting compound employing isotactic polyethylene may be provided by mixing that substance with a low density (atactic) polyethylene or with a microcrystalline wax or paraffin. The isotactic polyethylene in finely powdered form and the atactic polyethylene or wax in pellet or fl...