Browse Prior Art Database

Method For Producing Three Dimensional Printed Circuits

IP.com Disclosure Number: IPCOM000098742D
Original Publication Date: 1959-Dec-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Klippel, WH: AUTHOR

Abstract

This method of making a multiple layer printed circuit assembly having interconnections between. superimposed circuits includes the following steps. In the upper right figure a first conductive circuit pattern 1 is applied to the nonconductive base 2 by a conventional printed circuit process. An insulating material 3 is applied over the entire surface except at points (area 4, figure on left) where the circuit pattern 1 is to be connected to a second conductive circuit pattern 8. An adhesive layer 5 is applied exactly over the insulating material 3.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 86% of the total text.

Page 1 of 2

Method For Producing Three Dimensional Printed Circuits

This method of making a multiple layer printed circuit assembly having interconnections between. superimposed circuits includes the following steps. In the upper right figure a first conductive circuit pattern 1 is applied to the nonconductive base 2 by a conventional printed circuit process. An insulating material 3 is applied over the entire surface except at points (area 4, figure on left) where the circuit pattern 1 is to be connected to a second conductive circuit pattern 8. An adhesive layer 5 is applied exactly over the insulating material 3.

A thin conductive film 6 is applied over the entire surface including the walls of the area 4 and the exposed portion of circuit pattern 1, making a good electrical connection with the circuit pattern 1 and forming a base upon which the second conductive circuit pattern is to be electroplated. A negative pattern resist 7, complementary to the second conductive circuit pattern, is applied over the film 6 to resist electroplating. The second conductive circuit pattern 8 is electroplated on the exposed portions of the film 6. In the next step the adhesive 5 under the circuit pattern 8 is cured by placing the circuit assembly in the presence of an inductive heating source. The adhesive not under the conductive circuit pattern 8 is not cured because the conductive film 6 is of such minute thickness that the effect of the induction heating is negligible.

In the lower r...