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Multilayer Laminated Circuit Construction

IP.com Disclosure Number: IPCOM000098942D
Original Publication Date: 1964-Jul-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 2 page(s) / 57K

Publishing Venue

IBM

Related People

Haddad, MM: AUTHOR

Abstract

This is a process for producing a multilaminar printed circuit board which prevents dislocation of the conductor s during the laminating procedure.

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Multilayer Laminated Circuit Construction

This is a process for producing a multilaminar printed circuit board which prevents dislocation of the conductor s during the laminating procedure.

When a printed circuit is produced with closely spaced conductive elements, a problem occurs when incorporating such a circuit into a monolithic laminated structure. Due to the fact that there is no lateral support for the conductors, the application of pressure and heat during the laminating process causes the conductors to dislocate and results in either short-circuits or conductor ruptures. At A, a printed circuit is shown in which closely spaced circuit elements 10 are bonded to circuit board 12.

At B, elements 10 are immobilized by spreading a thixotropic (jelly-like) epoxy 14 over the entire surface of the circuit board so that all voids between the circuit lands are filled. Subsequently, the circuit board and epoxy covering 14 are subjected to a curing cycle to cause the epoxy to harden and create a flush surface.

Then, as at C, a number of circuit boards can be laminated without fear of dislocating the conductors. To prevent any short-circuits from occurring between the laminated circuit boards, a glass fiber spacer 16, which has been impregnated with an uncured resin, is inserted between the boards. Then, when heat and pressure are applied, the desired monolithic structure results.

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