Browse Prior Art Database

Flex Interconnection Aids

IP.com Disclosure Number: IPCOM000099133D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-14
Document File: 1 page(s) / 24K

Publishing Venue

IBM

Related People

Furman, BK: AUTHOR [+7]

Abstract

This disclosure describes the use of glass adhesives and both alignment and clamping to facilitate Flex solder joining to high I/O (e.g., thin film carriers). These aids allow easy Flex - substrate alignment, preservation of the alignment during handling and

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Flex Interconnection Aids

       This disclosure describes the use of glass adhesives and
both alignment and clamping to facilitate Flex solder joining to high
I/O (e.g., thin film carriers).  These aids allow easy Flex -
substrate alignment, preservation of the alignment during handling
and

      A typical process is as follows.  Using an adhesive M-bond from
measurement Group), the backbones are glued to the back side of the
Flex (opposite to the and OLB areas).  Following this, the I/Os on
the Flex aligned with respect to the matching I/Os on the using the
glass backbones and an alignment  With the use of a clamping fixture,
the Flex and substrate are then clamped together to preserve the
during solder reflow.  The glass backbones and an adhesive were found
to survive repetitive thermal between room temperature and liquid
nitrogen