Browse Prior Art Database

New Curing Process of Polyamic for Improvement

IP.com Disclosure Number: IPCOM000099135D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-14
Document File: 1 page(s) / 41K

Publishing Venue

IBM

Related People

Han, BJ: AUTHOR [+3]

Abstract

Disclosed is a new curing process for improvement adhesion strength of polymers to any substrate.

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This is the abbreviated version, containing approximately 85% of the total text.

New Curing Process of Polyamic for Improvement

       Disclosed is a new curing process for improvement adhesion
strength of polymers to any substrate.

      There are several factors that affect interface adhesion two
dissimilar materials, such as interfacial chemical mechanical
properties of the substrate and films, internal stress of films [*].
In a given material such as polyimide on any substrate where the
chemical reaction is intrinsically decided by the properties of the
polyamic acid, itself, internal stresses of a fully cured polyimide
is a simple method to improve its adhesion. internal stress of film
can be achieved simply by solvent content in the polyimide precursor,
when and slow curing.  This new process reduces because (1) it forms
a more homogeneous glassy film the thickness of the film and (2) the
excess amount of provides faster imidization reaction at lower  Since
most of the stress is created at a where the polymer passes from an
elastic state a glassy state, lowering this temperature by employing
a amount of solvent effectively reducing stress.  This is applicable
to any polymer including a blend of two more polymers.

      For example, increasing the NMP solvent content in du 5878
polyamic acid (therefore initial solid content is 5%) and slow
curing, such as 3 hours A-cure at 55oC, reduced the internal stress
to 1/4 of that of processed polyimide and increased its strength to
quartz more than 4 times.  Also, the treatment has increa...