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Browse Prior Art Database

Improving Mechanical and Adhesion of Polyimide Silicon Metal

IP.com Disclosure Number: IPCOM000099138D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-14
Document File: 2 page(s) / 75K

Publishing Venue

IBM

Related People

Baglin, J: AUTHOR [+5]

Abstract

A technique is described whereby high multi-level metalization of large-scale integrated (LSI) is improved through the use of surface treatment chemical vapor deposits so as to optimize adhesion and the mechanical properties of a polyimide interface.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 58% of the total text.

Improving Mechanical and Adhesion of Polyimide Silicon Metal

       A technique is described whereby high multi-level
metalization of large-scale integrated (LSI) is improved through the
use of surface treatment chemical vapor deposits so as to optimize
adhesion and the mechanical properties of a polyimide interface.

      LSI packaging requires highly multi-level metalization, where
the metalization pattern accomplished by conventional wetting
techniques. methods, such as dry etching or lift-off were developed
because the conventional etching limited the feature size of the
metalization

      In prior art, lift-off was considered an excellent for
producing featured metalized patterns.  However, metalization layer,
in the metalization of the lift-off delaminates from the polymeric
surface during high metal deposition.  Also, two sources of stress,
and differential (thermal contraction), occurred the process of
fabrication.  Elastic stress became an part of the deposition process
producing both and compressive stress.  The sign and magnitude of
stress became evident in parameters such as: substrate type of
substrate, and rate of deposition.

      The concept described herein provides a method of the
aforementioned stress problems by improving the at the interface and
by a surface treatment used in with a hydrolized coupling agent.

      The adhesion improvement consists of Si-Pi-Metal-Pi, as in
figure, through the use of CVD SiO2 at low temperatu...