Browse Prior Art Database

Flexible Film Interlead Support

IP.com Disclosure Number: IPCOM000099269D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-14
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Kaschak, RA: AUTHOR [+4]

Abstract

Disclosed is a method for supporting inner bond on a TAB-type flexible film structure by selectively dielectric material, leaving behind a "rectangle" of attached to all inner leads, thus supporting the and minimizing lead damage in subsequent processing.

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Flexible Film Interlead Support

       Disclosed is a method for supporting inner bond on a
TAB-type flexible film structure by selectively dielectric material,
leaving behind a "rectangle" of attached to all inner leads, thus
supporting the and minimizing lead damage in subsequent processing.

      As part of a TAB-type thin film chip carrier unsupported copper
lines must be defined and etched to form inner lead area ILB) and
outer lead bond area (OLB) perimeter leads for the chip and card
attachment. to Fig. 1, during the dielectric etch processing,
dielectric material is etched away completely in the of the TAB
structure, leaving the ILB leads and subject to damage from
subsequent such as spray wet processes, forced air drying, handling.

      Referring to Fig. 2, during the same dielectric process, the
dielectric would be etched only from ILB lead area in a "picture
frame" type pattern (Fig. 2, A), leaving the main dielectric pattern
(Fig. 2, area plus a "rectangle" of dielectric (Fig. 2, area C), and
supporting all previously unsupported ILB in the center.  This
supporting dielectric material then be excised either prior to or
during the chip process, as required.