Browse Prior Art Database

Module-To-Board Hybrid Connector

IP.com Disclosure Number: IPCOM000099274D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-14
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Dranchak, DW: AUTHOR [+3]

Abstract

Disclosed is an interconnection system for both and power between the bottom surface of a module (1) the top surface of a board (11). This concept provides signal density as well as improved signal integrity and transfer.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 92% of the total text.

Module-To-Board Hybrid Connector

       Disclosed is an interconnection system for both and power
between the bottom surface of a module (1) the top surface of a board
(11).  This concept provides signal density as well as improved
signal integrity and transfer.

      The signal connections are made from a series of pads that are
plated with a precious metal on the module (1) flex circuits (7)
which mate with contact interfaces on the board (11).

      The flex assembly has four main parts:  a flex circuit a
clamping/force distribution plate (8), and two pads (10).  The
assembly is created by attaching elastomeric pads to both sides of
the clamping/force plate and then wrapping the flex cable around
elastomer.  The flex assembly is attached to the module by means of
fasteners (9) and alignment pins (3) on the (1).

      Power connections are made through bifurcated-spring (4)
soldered into plated-through holes in the (11) and pins (5) brazed to
pads on the bottom surface the module (1).  Multiple rows of these
pins are located underneath the rows of chips (6) to minimize drops
as well as power dissipation.

      The multiple rows of bifurcated-spring connectors (4) protected
by an array carrier (12) that mates with the (5) on the module (1).
The module/flex assembly is aligned to the board by bullet shaped pin
in hole shown).  By driving the module parallel to the board contact
engagement is achieved with the pins (5) inserted into
bifurcated-...