Browse Prior Art Database

Defect-Free Apply and Bake Tool Configuration

IP.com Disclosure Number: IPCOM000099275D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-14
Document File: 4 page(s) / 141K

Publishing Venue

IBM

Related People

Balder, WB: AUTHOR [+5]

Abstract

An advanced tool configuration is described significant improvements in state-of-the-art apply and bake operations necessary to the for semiconductor wafers.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Defect-Free Apply and Bake Tool Configuration

       An advanced tool configuration is described significant
improvements in state-of-the-art apply and bake operations necessary
to the for semiconductor wafers.

      Many defects that result in substantial chip yield occur during
existing photoresist apply/bake  A general pictorial view of the
disclosed tool is shown in Fig. 1, and a top schematic view is shown
Fig. 2.  DEFAB processes semiconductor wafers, cassette cassette,
through robot-loaded, multiple coating, baking adhesion promotion
process steps, without operator inter

                            (Image Omitted)

vention.  It continuously particulate contamination levels during
these to assure compliance to specification.

      A self-monitoring system employs sensorized computer and offers
the following unique features:   Film thickness verification and
automatic process  built-in sensor non-destructively measures the
film of each wafer upon completion of processing and this information
to a personal computer (PC) 1. dispensing spin parameters are then
calculated, this data is forwarded to a controller 2 which alters
program, as necessary, for the next wafer, so as to wafer-to-wafer
film thickness variations within the lot.

      2)   Centering gripper: robot end-effector, without moving
parts, accurately the semiconductor wafer and eliminates the for a
separate centering station.  The robot 3 the wafer 4 to an inclined
position and cycles vacuum ports to lower it against positioning
stops.

      3)   A dual pinch valve photoresist dispensing system:
photoresist dispensing system 5 and 6 employs pinch in a valving
arrangement to control photoresist and 'suck- back' operations.  The
disclosed arrangement eliminates the numerous valves, and pneumatic
adjustments required in dispensing systems and avoids exposure of
photoresist mixture to the atmosphere, to moving parts, and to
operator handling.

      4)   Hot plate vapor control method: vapors are effectively
prevented from escaping the Clean Room environment by the employment
of a nozzle device above each hot plate 7, 8, 9, 11 and 12 (Fig.
2) to increase vertical laminar velocity.

      5)   Self-monitoring of contamination: contamination is
continuously monitored at lef...