Browse Prior Art Database

Stiffener System for Thin Film Technology

IP.com Disclosure Number: IPCOM000099276D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-14
Document File: 3 page(s) / 71K

Publishing Venue

IBM

Related People

Arldt, BD: AUTHOR [+2]

Abstract

This invention provides a generic stiffener system a thin film carrier with prescribed windows for chip

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This is the abbreviated version, containing approximately 100% of the total text.

Stiffener System for Thin Film Technology

       This invention provides a generic stiffener system a thin
film carrier with prescribed windows for chip

      The stiffener concept is to provide a "picture frame" any
substrate size with openings for chip location. 1 shows one
particular implementation of the on a 40 x 80 mm SIP version of a
thin film circuit 

                            (Image Omitted)

      The stiffener ribs provide: 1) a flat surface for chip SMT
mounting, 2) a stiff surface over the substrate so pressure contacts
will not deform the substrate, 3) defined windows for chip placement.
 Figure 2 shows I/O contacts on the back side of a thin film carrier
for a SIP version; both horizontal and vertical are shown.  Figure 3
shows a 40 x 40 mm planar

      Since the stiffeners are generic for similar size only a few
part numbers are needed, therefore cost.

      Another function of the stiffener is to capture the edge the
thin film substrate to prevent exposure of the power 

                            (Image Omitted)