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Solderable Pin for Multilayered Substrates

IP.com Disclosure Number: IPCOM000099321D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-14
Document File: 2 page(s) / 60K

Publishing Venue

IBM

Related People

Woychik, C: AUTHOR [+2]

Abstract

Disclosed is a method of surface treatment for KOVAR* pins. This method provides an efficient for joining said pins to metallic surfaces by and/or soldering techniques. The outer protective of the pin is made of plated copper protected with ENTEK is an organic coating that protects copper extensive oxidation, thus providing good shelf life for pin. With this type of pin metallization, it no longer necessary to do any pretinning of the pin prior to a assembly process.

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Solderable Pin for Multilayered Substrates

       Disclosed is a method of surface treatment for KOVAR*
pins.  This method provides an efficient for joining said pins to
metallic surfaces by and/or soldering techniques.  The outer
protective of the pin is made of plated copper protected with  ENTEK
is an organic coating that protects copper extensive oxidation, thus
providing good shelf life for pin.  With this type of pin
metallization, it no longer necessary to do any pretinning of the pin
prior to a assembly process.

      The wrought KOVAR pin will be overplated with 200-250m of
copper.  The pin will then be dipped in a bath of which is known to
be very effective in preventing the from oxidizing.  A schematic
illustration of the pin shown in Fig. 1.  A standard type of
commercial ENTEK ensure that the pin remain solderable for at least
year under room temperature conditions.  The pin can be attached to
the substrate using a standard braze Au, 20% Sn alloy) or even using
a Pb-Sn solderable  When the pin is attached to the substrate, the
high which occur during either soldering or brazing degrade the
ENTEK.  Therefore, subsequent exposure of pins on the substrate will
result in copper oxidation.

      The pins on the substrate are dipped in a solution of
persulfate-sulfuric acid, or another suitable oxide to remove the
surface copper oxide.  Only the of the pin that will be soldered into
the card will cleaned, leaving the top portion still oxidiz...