Browse Prior Art Database

Filled Structure With Lock-in

IP.com Disclosure Number: IPCOM000099344D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-14
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Cronin, JE: AUTHOR [+6]

Abstract

By creating mechanical undercut features in etched troughs in a substrate before filling with another material, resistance to adhesion loss during subsequent operations, such as polishing, is avoided.

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This is the abbreviated version, containing approximately 100% of the total text.

Filled Structure With Lock-in

       By creating mechanical undercut features in etched troughs
in a substrate before filling with another material, resistance to
adhesion loss during subsequent operations, such as polishing, is
avoided.

      Referring to Fig. 1, a layer 10 is deposited on substrate 12.
Masking layer 14, having an opening A, is formed on top of layer 10.
Layer 10 is then etched by a means having a degree of lateral attack,
i.e., not completely anisotropic etching.  Ion etching at relatively
high gas pressure is one such means.  Mask layer 14 may then be
removed and a fill material 16 conformally deposited or, in some
cases, mask material 14 may be left in place as shown.

      Referring to Fig. 2, fill material 16 is reflowed by laser or
other heat treatment appropriate to filling the void left during
conformal deposition.   Planarization to the level of the top or
bottom surface of mask material 14 may be done by means such as
mechanical polishing without losing fill material 16 which is below
the polished surface.

      In some cases, reflow of the fill material may be avoided by
simply roughening sidewalls of vertically etched material 10 by
plasma etching.