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Filling Vias in Ceramic Green Sheets

IP.com Disclosure Number: IPCOM000099345D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-14
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Chance, DA: AUTHOR [+3]

Abstract

Disclosed is a dry process for filling vias in green sheets of ceramic or glass. The process eliminates smears that cause electrical shorts between vias and between vias and lines. Hence, modules with more densely populated vias and wiring may be fabricated.

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Filling Vias in Ceramic Green Sheets

       Disclosed is a dry process for filling vias in green
sheets of ceramic or glass.  The process eliminates smears that cause
electrical shorts between vias and between vias and lines.  Hence,
modules with more densely populated vias and wiring may be
fabricated.

      In the typical process for fabricating ceramic modules, the
vias are punched and then filled with a metallizing paste.  Such
processes require metallizing paste to be forced through a mask into
the via hole.  Problems are encountered which include interaction
between the paste solvent and the green sheet, incomplete fill and
paste smears caused by sheet movement before complete drying. These
problems can be avoided by punching a green sheet of the
metallization composition into the hole of a green ceramic sheet.  An
example of such a process is illustrated in Fig. 1.

      The ceramic green sheet is punched in the usual manner, as
shown in Fig. 1A.  It is then necessary to locate the punched hole
beneath a green sheet of the metallizing composition on a flat
surface, as shown in Fig. 1B.  The metal green sheet is then punched
using a punch travel similar to the thickness of the green sheets to
fill the hole in the ceramic green sheet.  The latter process is
shown in Fig. 1C.