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Browse Prior Art Database

Enhanced High Density Array Connector

IP.com Disclosure Number: IPCOM000099372D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-14
Document File: 2 page(s) / 97K

Publishing Venue

IBM

Related People

Asselta, JA: AUTHOR [+6]

Abstract

This arrangement extends the usability of existing module connectors by providing additional contacts within a given design area. The current fully populated design is disclosed in U.S. Patent 3,915,537 and is illustrated in Figs. 1 and 2 herein. An all-plastic contact cavity carrier 1 has a contact cavity field 2 therein having a contact capacity of 1800 positions, for example. A camming feature 3 is molded into the carrier. Contact elements such as 4 are located in the dielectric mold cavity 5, the contacts being a part of a circuit board 6. A module pin 7 is inserted downwardly into the mold cavity, and, after insertion, the pin is cammed horizontally into engagement with the contact, as indicated by the arrow 8. This design is limited by present molding technology to approximately 2000 contact locations.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 69% of the total text.

Enhanced High Density Array Connector

       This arrangement extends the usability of existing module
connectors by providing additional contacts within a given design
area.  The current fully populated design is disclosed in U.S. Patent
3,915,537 and is illustrated in Figs. 1 and 2 herein.  An all-plastic
contact cavity carrier 1 has a contact cavity field 2 therein having
a contact capacity of 1800 positions, for example.  A camming feature
3 is molded into the carrier.  Contact elements such as 4 are located
in the dielectric mold cavity 5, the contacts being a part of a
circuit board 6.  A module pin 7 is inserted downwardly into the mold
cavity, and, after insertion, the pin is cammed horizontally into
engagement with the contact, as indicated by the arrow 8.  This
design is limited by present molding technology to approximately 2000
contact locations.  This capability can be expanded in two ways.

      (1) Within the limits of present molding materials and
techniques additional contacts can be provided within a given module
site by using a larger contact module area and de-populating the
plastic molding contact positions, thus providing better capability
for plastic flow, increased mechanical strength, and acceptable
contact cavity dimensional accuracy.  Fig. 3 is illustrative, and
shows a metal camming feature 9 in the molded plastic carrier 10, and
a contact pattern 11 de-populated for added strength.

      (2) At the point where existing mol...