Browse Prior Art Database

Method of Manufacture of Miniature Coaxial Cable

IP.com Disclosure Number: IPCOM000099422D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-14
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Hodgson, RT: AUTHOR [+2]

Abstract

Disclosed is a method of using conventional semiconductor and packaging technology to make arrays miniature coaxial cables for high-frequency, noise-free communication.

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This is the abbreviated version, containing approximately 100% of the total text.

Method of Manufacture of Miniature Coaxial Cable

       Disclosed is a method of using conventional semiconductor
and packaging technology to make arrays miniature coaxial cables for
high-frequency, noise-free communication.

      Fig. 1 shows a sketch of the starting material, which is a
flexible polymer carrier 1 on which a metal layer 2, preferably
copper, has been evaporated, plated or laminated. A layer of polymer
3, such as polyimide, is put on the metal with carefully controlled
thickness.

      Lines of metal 4 are put down on the polymer 3 with normal
semiconductor or packaging techniques, such as evaporation,
photoresist application, photoresist exposure, photoresist develop,
and plating, photoresist strip, and metal etch to give a structure
shown in Fig. 2.

      A layer of polymer 5 is then laid down on the metal lines, and
slots 6 are cut in the polymer using an excimer laser to ablate the
polymer between the lines to give a structure with cross section
given in Fig. 3.

      The material is then electroplated up from the metal base 2 so
that the entire surface is then covered with metal 7 to give a final
cross section shown in Fig. 4, which is a multiplicity of conductors,
each fully encased in a grounded conductor which stops pick-up and
crosstalk between the lines.