Browse Prior Art Database

Enhanced Surface Cleaning With Ozone

IP.com Disclosure Number: IPCOM000099433D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-14
Document File: 1 page(s) / 37K

Publishing Venue

IBM

Related People

Brady, MJ: AUTHOR [+3]

Abstract

Disclosed is a process that provides a high concentration of ozone for enhanced surface cleaning of bonding sites, substrates, etc. Prior art teaches a way of cleaning surfaces (*) with ultraviolet and ozone, but has the disadvantage of being cumbersome, expensive and is process dependent on numerous variables.

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Enhanced Surface Cleaning With Ozone

       Disclosed is a process that provides a high concentration
of ozone for enhanced surface cleaning of bonding sites, substrates,
etc.  Prior art teaches a way of cleaning surfaces (*) with
ultraviolet and ozone, but has the disadvantage of being cumbersome,
expensive and is process dependent on numerous variables.

      An important manufacturing application of ozone cleaning is in
wire bonding to gold surfaces of various semiconductor devices.  The
cleaning of a gold surface with ozone results in a lower bonding
interface energy, and improved reliability.  The process disclosed
avoids the use of ultraviolet, provides for higher throughput, is
more efficient, and eliminates a safety hazard.  The method disclosed
provides a high dosage of ozone in a gaseous mode, via a nozzle, or
an array of nozzles, directly to the bonding site or pad.  The
efficiency of surface cleaning is enhanced in several ways:  the
distance from the source of ozone to the bonding site is reduced
since a nozzle provides a line of sight delivery of ozone, allows for
close coupling, and provides for high concentrations of ozone.  An
additional application can be realized in the "ashing" of organic or
polymeric materials often involved in semiconductor manufacturing.
This application includes, but is not limited to, cleaning
photoresist residue left over from lithographic steps, etching
polymers in packaging modules, cleaning carbonaceous debris r...