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Radio Frequency Interference Suppression Clip And Mechanical Guidance Aid

IP.com Disclosure Number: IPCOM000099438D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-14
Document File: 2 page(s) / 59K

Publishing Venue

IBM

Related People

Cutts, SJ: AUTHOR [+3]

Abstract

A method is described of bonding metal assembly cases within metal housings designed to accept them to restrict the emission of electrical interference from the assemblies. Typical assemblies could be electro-mechanical disk files mounted in rack housings. Novel bonding clips which also serve the purpose of centralizing assemblies within their housings have been manufactured and implemented.

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Radio Frequency Interference Suppression Clip And Mechanical Guidance Aid

       A method is described of bonding metal assembly cases
within metal housings designed to accept them to restrict the
emission of electrical interference from the assemblies. Typical
assemblies could be electro-mechanical disk files mounted in rack
housings.  Novel bonding clips which also serve the purpose of
centralizing assemblies within their housings have been manufactured
and implemented.

      With reference to the figure, an assembly 1 is designed to
slide into a receiving compartment formed in a housing 2 by one side
8 and a central partition 5 and bulkhead 4 at the rear of the
compartment.  When fully engaged the assembly 1 plugs in electrically
into sockets 7 in the bulkhead 4.  The requirement is that the
compartment and the casing of the inserted assembly should form the
boundary of a Faraday cage, thus preventing radio frequency radiation
from entering or leaving the assembly.  Efficient grounding of the
assembly casing 1 and the compartment sides is achieved by means of
suppression clips 3 which are made from conducting spring material
fixed to the bulkhead and tensioned to exert a sliding force on the
sides of the assembly case 1 until fully engaged.  Clips 3 act as
radio frequency emission seals by creating multiple ground contacts
between the conducting surfaces of the assembly case 1 and the
conducting walls of the enclosed compartment 2, 4, 5 and 8.  The
conduc...