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Method of Planarizing Polyimide Surfaces

IP.com Disclosure Number: IPCOM000099487D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-14
Document File: 1 page(s) / 15K

Publishing Venue

IBM

Related People

Hoerner, E: AUTHOR [+2]

Abstract

Uneven surfaces of polyimide substrates baked at about 130oC are planarized by partially dissolving a top surface layer of the polyimide, followed by spinning. As a result, the layer is rearranged in substantially planar distribution on the polyimide substrate. Suitable solvents are, for example, N-methyl-pyrrolidone and aqueous alkaline solutions.

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Method of Planarizing Polyimide Surfaces

       Uneven surfaces of polyimide substrates baked at about
130oC are planarized by partially dissolving a top surface layer of
the polyimide, followed by spinning.   As a result, the layer is
rearranged in substantially planar distribution on the polyimide
substrate.  Suitable solvents are, for example, N-methyl-pyrrolidone
and aqueous alkaline solutions.

      Planar surfaces are becoming increasingly important in
semiconductor technology.