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Structure for Electro-Erosion Printing

IP.com Disclosure Number: IPCOM000099526D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 1 page(s) / 37K

Publishing Venue

IBM

Related People

Cohen, MS: AUTHOR [+3]

Abstract

It is observed in electro-erosion recording media that the polymer substrate/hard coat does participate during writing as evidenced by the transfer of pattern into the substrate. Such a secondary erosion is detrimental to the overall performance of a particular structure especially when the debris is soft and adherent in nature, resulting in headfouling cessation of writing and possibly undesired mechanical abrasion of the metallic surface.

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Structure for Electro-Erosion Printing

       It is observed in electro-erosion recording media that the
polymer substrate/hard coat does participate during writing as
evidenced by the transfer of pattern into the substrate. Such a
secondary erosion is detrimental to the overall performance of a
particular structure especially when the debris is soft and adherent
in nature, resulting in headfouling cessation of writing and possibly
undesired mechanical abrasion of the metallic surface.

      A new structure is proposed in the figure that has a thin
aluminum oxide or alternate inorganic or organometallic film of 200
Ao-1K Ao thickness interposed between the polymeric base coat and a
conductive film, such as Al, Mg, silver, etc., with the usual
protective lubricant top coat.  Such a structure offers several
advantages, specifically:  (a) eliminate or minimize accumulation of
organic debris on the print head, (b) provide the necessary hard base
layer and (c) provide higher differential of stress and thermal
coefficient of expansion (TCE) between the organic-inorganic
interface and consequently facilitate the erosion process (TCE of Al
= 23 x 10-6; Al2O3 = 7 x 10-6; organic polymers = 40-50 x 10-6).

      Other inorganic films, such as SiO2, SrOx, silicon nitride,
aluminum nitrate or organometallic thin films, such as
organosilicons, can also be employed for fabrication of similar
structures.  These barrier films can be deposited either directly on
plastic sub...