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Multi-Orifice Fluorocarbon Impingement Cooling for Arrays of Microelectronic Devices

IP.com Disclosure Number: IPCOM000099568D
Original Publication Date: 1990-Feb-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Carbone, MC: AUTHOR [+3]

Abstract

Disclosed is a technique for cooling arrays of micro-electronic chips using impinging jets of fluorocarbon (FC) liquid. This method enables cooling chips of much higher powers than does the use of transverse flow or pool boiling of FC liquid. Two aspects are central to the technique: jet emitters that produce a high performance flow geometry and protruding shafts to provide exit paths for the exhausting fluid.

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Multi-Orifice Fluorocarbon Impingement Cooling for Arrays of Microelectronic Devices

       Disclosed is a technique for cooling arrays of
micro-electronic chips using impinging jets of fluorocarbon (FC)
liquid.  This method enables cooling chips of much higher powers than
does the use of transverse flow or pool boiling of FC liquid.  Two
aspects are central to the technique: jet emitters that produce a
high performance flow geometry and protruding shafts to provide exit
paths for the exhausting fluid.

      A high convective coefficient flow geometry is created on the
surface of each chip by the use of four carefully placed orifices.
The use of multiple small orifices reduces the required volume flow
rate of liquid and decreases the temperature range across each chip.
Orifices are used rather than nozzles to increase the amount of free
stream turbulence in the jets and enhance heat transfer.  Placement
of the orifices is best determined by using the dimensionless
parameter rho.  Rho equals the radius of a circle crossing the
orifices divided by half the diagonal length of the chip (see Fig.
1).  For jets of diameter 0.5 mm, working fluid of Fluorinert 72*,
and chip size near 7 mm, the optimum rho is near 0.33.

      The jet emitters are placed on the ends of protruding shafts to
separate the coolant-in-use from the exhaust flow (see Fig. 2).  This
enables the jet emitters to create the desired local flow geometry on
the surfaces of the chips without be...