Browse Prior Art Database

Robotic Wafer Handling System for Class 10 Environments

IP.com Disclosure Number: IPCOM000099580D
Original Publication Date: 1990-Feb-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 3 page(s) / 121K

Publishing Venue

IBM

Related People

Lisanke, MG: AUTHOR [+3]

Abstract

A technique is described whereby a robotic wafer hand- ling system, as used in the fabrication of integrated circuits, provides automatic cycling of wafers in a class 10 clean room environment, by controlling particle producing mechanisms.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Robotic Wafer Handling System for Class 10 Environments

       A technique is described whereby a robotic wafer hand-
ling system, as used in the fabrication of integrated circuits,
provides automatic cycling of wafers in a class 10 clean room
environment, by controlling particle producing mechanisms.

      Referring to the drawing, the system is a self-contained unit
consisting of base 10, robot unit 11, multi-gripper 12, four cassette
nests 13, aligner 14, carrier spreader 15, idle stand 16, X, Y, Z-
sensing device 17 and light curtain 18.  Mounted in base 10 are the
controls, consisting of a central processing unit, to drive the
robot.  An interface circuit card (not shown) provides the electrical
connection to an external vacuum processing system for the control of
pneumatic valves for robot unit 11.  Numerous strategically placed
sensors interconnect to the central processing unit, located remotely
from the system, for controlling the mechanism's movement while in
operation.

      Top mounting plate 19 is designed to prevent undesirable air
turbulence, which could cause particles to become airborne.  To
accomplish this, cut-outs 20 are located near the sub-assemblies.
This elim- inates an area for particle accumulation on mounting plate
19 and allows an undisturbed downward flow of clean air through top
mounting plate 19.

      Robot unit 11 is designed to operate in a class 10 clean room
environment.  Multi-gripper 12 connects to the arm of robot unit 11
to perform two tasks: to manipulate the carrier and to manipulate
wafer 21.  Pneumatic air operates the multi-gripper 12 so that
fingers attached to each side of the gripper can grasp and secure the
carrier (see the preceding article).  Another finger, on
multi-gripper 12, secures wafer 21 by means of a vacuum attachment.
The vacuum attachment allows random access to the wafers from their
cassette nests 13.  All of the processing sub-assemblies are
strategically mounted on top plate 19 so that robot unit 11 can
maneuver without having to violate the air space over the wafers, or
sub-assemblies.

      A potentiometer pos...