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Contactless Coupling of RF Power to a Rotating Height-Adjustable SubStrate Table for a Sputter/Sputter Etch System

IP.com Disclosure Number: IPCOM000099637D
Original Publication Date: 1990-Feb-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 67K

Publishing Venue

IBM

Related People

Rabe, G: AUTHOR

Abstract

The article describes the capacitive, yet contactless, coupling of RF power to a rotating height-adjustable substrate table for a sputter system. This approach may be used for systems, whose substrate table has to be energized for etching and must be height-adjustable (anode/ cathode spacing) for sputtering or for receiving (loading) a substrate pallet.

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Contactless Coupling of RF Power to a Rotating Height-Adjustable SubStrate Table for a Sputter/Sputter Etch System

       The article describes the capacitive, yet contactless,
coupling of RF power to a rotating height-adjustable substrate table
for a sputter system.  This approach may be used for systems, whose
substrate table has to be energized for etching and must be
height-adjustable (anode/ cathode spacing) for sputtering or for
receiving (loading) a substrate pallet.

      The described approach has been tested for power densities of 1
W/cm2 at 3 kW RF.

      The sectional view shows only the lower portion of a vacuum
chamber.  Base plate 1 (bottom of vacuum chamber) is visible, through
which ferrofluid-sealed rotating feed-through 2 and insulator
stand-off/power connection 7, 11 extend.  The rotating feed-through
is fitted with stainless steel vacuum bellows allowing height
adjustment of the substrate table.  The substrate table assembly 3 to
6 is shown above the base plate.

      Details
   a) The substrate table assembly consists of a water-cooled
substrate table 3 of, say, copper, and of an insulator piece 5
comprising an annular water-cooled capacitor plate 6.  Between the
substrate table 3 and capacitor plate 6, there is a vacuum gap of
about 1.5 mm. Insulator piece 5 and the side walls of substrate table
3 are shielded by a dark space shield 4.  The dimensions and the
material of insulator piece 5 are selected for minimum dissipatio...