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Browse Prior Art Database

Improved Printed Circuit Board Construction

IP.com Disclosure Number: IPCOM000099688D
Original Publication Date: 1990-Feb-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 61K

Publishing Venue

IBM

Related People

Reeber, AA: AUTHOR

Abstract

A technique is described whereby the structure of printed circuit boards is improved so as to enhance wiring capabilities. Through the use of a redesigned surface mounting pad, voltage and ground circuitry is integrated into the surface mounting structure of the board, thereby either eliminating the layers or making the layers available for additional signal wiring.

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Improved Printed Circuit Board Construction

       A technique is described whereby the structure of printed
circuit boards is improved so as to enhance wiring capabilities.
Through the use of a redesigned surface mounting pad, voltage and
ground circuitry is integrated into the surface mounting structure of
the board, thereby either eliminating the layers or making the layers
available for additional signal wiring.

      In the prior-art construction, as shown in Fig. 1, separate
layers of fiber glass and copper voltage and ground planes were
required for the interconnection of the top surface down through to
the bottom surface for the mounting of discrete components.  The top
surface typically consisted of a surface mounting pad, as shown in
Fig. 1a, so as to provide a via for connection to all the planes.
Separate voltage and ground planes layers were required which limited
the signal current and caused manufacturing problems due to clearance
at the lands.

      The concept described herein is designed to combine the power
planes in the area of the mounting pads planes, as shown in Fig. 2.
The island around all the pads and their vias are etched away so that
this area can be used for voltage or ground connections.  The
internal connections to the circuits at the various layers can then
be made without considering the blockage occurring due to the voltage
and ground plane connections, as shown in Fig. 2a.