Browse Prior Art Database

Improved Thermal Electric Cooler for Solid-State Devices

IP.com Disclosure Number: IPCOM000099690D
Original Publication Date: 1990-Feb-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 64K

Publishing Venue

IBM

Related People

Mosley, J: AUTHOR [+3]

Abstract

A technique is described whereby the wiring of a thermal electric cooler, as used in solid-state semiconductor devices, is improved so as to provide "fail-safe" operation in the event of an open circuit.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 62% of the total text.

Improved Thermal Electric Cooler for Solid-State Devices

       A technique is described whereby the wiring of a thermal
electric cooler, as used in solid-state semiconductor devices, is
improved so as to provide "fail-safe" operation in the event of an
open circuit.

      In prior art, the entire thermal electric cooler (TEC) would
become inoperative in the event an open circuit should occur.    The
primary reason for failure was in the serial determination of the
interface wiring.  The concept described herein provides a method of
wiring the elements in such a way so as to provide a "healing" effect
whereby failures to the series path cause a partial loss in cooling,
not a total failure of the device. Essentially, a parallel path
determination is used.

      The figure illustrates the interconnection of the wiring used
in connecting the TEC elements.  The elements are "strapped" together
at several places in such a manner so as to provide a redundant path
capable of carrying the total current for the rest of the parallel
paths.

      Although the elements are strapped together, a significant
amount of failure tolerance can occur.  Since the corners are
strapped together, it can be concluded that any failure would result
in a loss of six elements out of a base of thirty-six, as shown in
this illustration. Therefore, a failure would result in a loss of
sixteen percent of the thermal pumping capability.  This is
considered satisfactory in the range...