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Retention of Pin-Through-Hole Components On Printed Circuit Boards Before Soldering

IP.com Disclosure Number: IPCOM000099699D
Original Publication Date: 1990-Feb-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 77K

Publishing Venue

IBM

Related People

Carollo, M: AUTHOR

Abstract

Retention of any pin-through-hole components on any printed circuit board, before soldering, is accomplished by injecting microdrops of adhesive into selected plated-through-holes on the board, from the back side thereof, either before or after assembly of the components.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 53% of the total text.

Retention of Pin-Through-Hole Components On Printed Circuit Boards Before Soldering

       Retention of any pin-through-hole components on any
printed circuit board, before soldering, is accomplished by injecting
microdrops of adhesive into selected plated-through-holes on the
board, from the back side thereof, either before or after assembly of
the components.

      A known process for temporary retaining pin-through-hole
components on boards consists in clinching the leads after assembly.
This not only involves the risk of damaging the leads, but renders
the leads difficult to remove after soldering, with the resulting
risk of damaging the circuit during removal of the components for
repair. Further, when the leads are very thin or when the leads or
the boards are very thick, clinching the leads may prove impossible
or impractical. Another known approach consists in sticking the
leads. This is carried out by spreading, prior to assembling the
components, an adhesive on one of the faces of the board, which
adhesive will mix with the solder flux during preheating of the
assembly. While this does not involve some of the disadvantages
inherent in the clinching of the leads, this may nevertheless cause a
degradation of the dielectric properties of the board, if an
excessive amount of adhesive is used, or at least renders the manual
positioning of the components impractical, because the whole hole
grid is filled with adhesive.

      The disadvantages of the known...