Browse Prior Art Database

25-Mil High Density Connector

IP.com Disclosure Number: IPCOM000099835D
Original Publication Date: 1990-Feb-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 3 page(s) / 65K

Publishing Venue

IBM

Related People

Neer, JH: AUTHOR [+2]

Abstract

This article describes a layout design which allows a manufacturable pattern of high density spacing to a printed circuit board (PCB).

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 67% of the total text.

25-Mil High Density Connector

       This article describes a layout design which allows a
manufacturable pattern of high density spacing to a printed circuit
board (PCB).

      The use of processor daughter cards and pluggable functional
islands has dictated the need for a high density interconnect for use
in personal computer (PC) systems.  The 50-mil or half-pitch card
edge connector system is too large for the new applications noted
above and future applications.  Accordingly, a 25-mil horizontal
pitch interconnect system, designed to meet the high density
requirements, is disclosed herein.  25 mils was chosen because it
corresponds to the minimum pitch of existing PCB processing
equipment.

      The fundamental problem with high density interconnect PC
systems is their manufacturability, particularly the spacing between
pins as they are affixed to the PCBs.  The high density connectors
available typically fan out to staggered 50 x 75 or 100-mil grids for
their PCB footprint. This obviously is too large for a 25-mil grid.

      A connector footprint is disclosed herein which enables the use
of current manufacturing techniques to reliably mount the connector
to the PCB.  The front face of the connector and PCB layout is
illustrated in Fig. 1.  The basic horizontal pitch is 25 mils from
pin to pin.  The vertical grid component however is 75 mils minimum.
This offset pattern permits maximum bussing of lines through the
connector system and theref...