Browse Prior Art Database

Clip-On Heat Sink for Memory Single In-Line Memory Module

IP.com Disclosure Number: IPCOM000099837D
Original Publication Date: 1990-Feb-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Cutt, PS: AUTHOR [+4]

Abstract

This article describes a heat sink which cools a single in-line memory module.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Clip-On Heat Sink for Memory Single In-Line Memory Module

       This article describes a heat sink which cools a single
in-line memory module.

      A single in-line memory module is an industry standard memory
package used in personal computers.  Fig. 1 shows a typical single
in-line memory module configuration.  Fig. 2 shows a single in-line
memory module with the heat sink disclosed herein installed. It is a
device that is easily attached and removed from the module by means
of spring fingers.  This permits easy rework of the module.

      The heat sink is made from a piece of sheet metal by stamping
and forming processes.  Individual spring fingers on the heat sink
mate with the memory modules on the single in-line memory module, as
shown in the end view of Fig. 3. This provides good thermal contact
on each module.  By using a base metal of copper or aluminum and a
plating of soft indium on the spring fingers, the thermal interface
can be enhanced.  The spring fingers allow for flexible tolerances on
single in-line memory module and module heights.

      The top fin design can be customized to a specific airflow or
power requirements.  Since single in-line memory modules vary in size
and layout, different heat sinks would be required.  This concept
lends itself to variation as to the size, layout and power change of
single in-line memory modules.