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Browse Prior Art Database

High Density, Low Cost Board-To-Card Connector

IP.com Disclosure Number: IPCOM000099881D
Original Publication Date: 1990-Feb-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 63K

Publishing Venue

IBM

Related People

Nestork, WJ: AUTHOR

Abstract

By forming contacts on flat material which is thin and flexible, lithographic methods are used to make a high density of contacts. After contacts and lines are formed and electroplated with a good contact surface material, the flexible circuitry is folded and mounted in a molded plastic base carrier. The base carrier is comprised of two parts joined by springs, thus permitting the contacts to be separated during card insertion or removal. The assembly of base carrier and contacts is electrically and mechanically joined to a wiring board by soldering lines on the connector to wiring on the board.

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High Density, Low Cost Board-To-Card Connector

       By forming contacts on flat material which is thin and
flexible, lithographic methods are used to make a high density of
contacts.  After contacts and lines are formed and electroplated with
a good contact surface material, the flexible circuitry is folded and
mounted in a molded plastic base carrier.  The base carrier is
comprised of two parts joined by springs, thus permitting the
contacts to be separated during card insertion or removal.  The
assembly of base carrier and contacts is electrically and
mechanically joined to a wiring board by soldering lines on the
connector to wiring on the board.

      Referring to Fig. 1, contact regions 10 are plated on lines 12
which are formed on flat flexible substrate 14. Pretinned solder pads
16 surround holes through substrate 14. Plating, e.g., dendritic
tungsten, on contact regions 10 is for enhanced penetration of card
contacts and resultant high contact reliability.  Solder pads 16 are
used subsequently for making mechanical and electrical connections to
a wiring board.

      Referring to Fig. 2, molded base part 18 is joined to molded
base part 20 by inserted springs 22 on each end of the molded base
parts 18 and 20.  Compliant elastomer inserts 24 are then assembled
into base parts 18 and 20. Wiring 12 and flexible substrate 14, shown
in Fig.  1, are folded along the dashed lines, shown in Fig. 1, and
inserted in and glued to inner walls of the molded...