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Tape Circuit Layout And Punching Apparatus to Allow Testing Of Mounted Chips

IP.com Disclosure Number: IPCOM000099883D
Original Publication Date: 1990-Feb-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 3 page(s) / 80K

Publishing Venue

IBM

Related People

Adams, GE: AUTHOR [+2]

Abstract

As a standard practice, semiconductor circuit chips are thermo-compression bonded to conductive fanout terminals on an insulating tape by tape automated bonding (TAB). The terminals are all terminated on grounded, conductive frames on the tape to avoid electrostatic discharge damage to the chips. Shipping and storage of mounted chips in rolls of tape are also standard. To make it possible to test these mounted chips prior to cutting the tape, terminal grounding design is changed such that several small punchouts along each edge of the fanout sever all ground frame terminations. An apparatus to make the precision punchouts and protect against electrostatic damage (ESD) to chips during punching and re-rolling is described.

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Tape Circuit Layout And Punching Apparatus to Allow Testing Of Mounted Chips

       As a standard practice, semiconductor circuit chips are
thermo-compression bonded to conductive fanout terminals on an
insulating tape by tape automated bonding (TAB).  The terminals are
all terminated on grounded, conductive frames on the tape to avoid
electrostatic discharge damage to the chips.  Shipping and storage of
mounted chips in rolls of tape are also standard.  To make it
possible to test these mounted chips prior to cutting the tape,
terminal grounding design is changed such that several small
punchouts along each edge of the fanout sever all ground frame
terminations. An apparatus to make the precision punchouts and
protect against electrostatic damage (ESD) to chips during punching
and re-rolling is described.

      Referring to Fig. 1, semiconductor chip 10 is connected to
fanout wiring 12 on flexible tape 14.  Groups of terminals 16 of
fanout wiring 12 are connected to a grounded, conductive border area
18 via fanned-in small lines 20.  A series of very small regions 22
are punched out of tape 14 to disconnect fanout terminals 16 from
grounded border 18, thus enabling the testing of mounted chip 10
while still being carried on a long ribbon of tape.

      Referring to Fig. 2, an input reel 20 feeds chips 10 on tape 14
toward tape track and die plate 26 and liner tape 22 toward rewind
reel 24 which is driven by a high slip torque motor (not shown).
Tape 14...