Browse Prior Art Database

Hybrid Wafer Scale Integration Package Connector Mount to Card

IP.com Disclosure Number: IPCOM000099894D
Original Publication Date: 1990-Feb-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 1 page(s) / 47K

Publishing Venue

IBM

Related People

Robbins, MA: AUTHOR [+2]

Abstract

Very large-scale integration (VLSI) devices can achieve optimum system enhancement with a hybrid wafer-scale integration (HWSI), hermetically sealed package interconnected to the system card with a surface mount connector and thermal sink-mounting technique.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 79% of the total text.

Hybrid Wafer Scale Integration Package Connector Mount to Card

       Very large-scale integration (VLSI) devices can achieve
optimum system enhancement with a hybrid wafer-scale integration
(HWSI), hermetically sealed package interconnected to the system card
with a surface mount connector and thermal sink-mounting technique.

      The VLSI chips 8 are flip-chip solder 9 interconnected to the
thin film interconnection wafer 10, wire bond or tape automated
bonded (TAB) 12 to the multichip package (MCP) 2, and wire button or
elastometric connector 1 mounted to the system card 4.  The
interconnection wafer 10 is bonded with a thermoplastic adhesive 11
to the MCP which is hermetically solder sealed.  The HWSI-MCP module
2 is bonded (5) to the MCP top hat 6 with a thermal filled compound.
The MCP top hat 6 engages the HWSI-MCP 2 and wire button connector 1
to the system card 4 with mounting rail hardware 7 to the system
frame 3.

      The system is enhanced with the HWSI-MCP pluggable interconnect
on one side and the thermal/mechanical attachment on the opposite
side of the module.  The wire button connector provides compact
pluggable interconnection density for improved system electrical
performance with HWSI-MCP-VLSI modules.  The top hat provides an
efficient thermal path to improve system reliability with the high
thermal densities of HWSI-MCP-VLSI modules.  In addition, the top hat
provides quick, pluggable, mechanical engagement of the MCP to the
conne...