Browse Prior Art Database

Multi-Functional Feature Cover System

IP.com Disclosure Number: IPCOM000099897D
Original Publication Date: 1990-Feb-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 69K

Publishing Venue

IBM

Related People

Schultz, KL: AUTHOR

Abstract

Described is a feature card-packaging system. This system allows a customer to easily stack feature cards onto an existing logic card and lock it into place.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Multi-Functional Feature Cover System

       Described is a feature card-packaging system.  This
system allows a customer to easily stack feature cards onto an
existing logic card and lock it into place.

      Customer installability of feature cards is often difficult and
in many cases may result in damage to the feature.

      The system described here (Fig. 1) encapsulates the card in a
set of covers.  The top is a molded plastic that can dissipate a
static charge.  The bottom is made of metal which helps to reduce
EMC.  Also included is an insulator to prevent shorting and a
thumb-screw which locks the system in place.

      The system snaps together, then two screws are added to help
form a ground from the bottom cover to the card.

      Using the same card layout, many different features can use
this packaging technique.  Depending on the type of feature
connection, the only change necessary would be to the back panel of
the bottom cover.

      This feature system may now be added to the logic card by
stacking and snapping it into place on the existing logic card (Fig.
2).  The thumb-screw can then be tightened to form a ground from the
feature to the main chassis.  This also ensures that the feature will
be retained.  A second feature may then be stacked on the first.
Stacking is allowed due to the offset of the connectors that mate the
features and logic.