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Hybrid Grad/Wire Wrap Board Design

IP.com Disclosure Number: IPCOM000099933D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 1 page(s) / 30K

Publishing Venue

IBM

Related People

Quick, JH: AUTHOR

Abstract

A hybrid connector motherboard features 26 card positions containing 268 I/O contacts in each card socket location. The design integrates both GRAD connector contacts (G/C) and commercial high pin count, one-piece connector systems assembled to the board in alternating card positions. This design approach was used to overcome the GRAD connector board's limited capability of discrete wire additions. Normally, continual twisted pair wires are solder bonded to the signal and ground lands on the Engineering Change (EC) plane side of the board using specially designed workstations. EC plane wire additions are limited to a small number of overflows, engineering changes, and emergency repairs.

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Hybrid Grad/Wire Wrap Board Design

       A hybrid connector motherboard features 26 card positions
containing 268 I/O contacts in each card socket location. The design
integrates both GRAD connector contacts (G/C) and commercial high pin
count, one-piece connector systems assembled to the board in
alternating card positions.  This design approach was used to
overcome the GRAD connector board's limited capability of discrete
wire additions. Normally, continual twisted pair wires are solder
bonded to the signal and ground lands on the Engineering Change (EC)
plane side of the board using specially designed workstations.  EC
plane wire additions are limited to a small number of overflows,
engineering changes, and emergency repairs.

      To overcome these limitations, the 26 card positions are
divided into 13 connector pairs.  Each pair consists of one GRAD
connector socket and one commercial high pin count, wire-wrap
connector socket.  Each of the thirteen connector pairs are connected
together using a pin-for-pin mapping scheme on the internal signal
planes.  Although simple in concept, the design offers a quick and
convenient way to assemble discrete connectors and interconnecting
wires early in the engineering design cycle.