Browse Prior Art Database

Frame-Mounted TAB Component

IP.com Disclosure Number: IPCOM000099949D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Gafford, WR: AUTHOR

Abstract

At present Tape Automated Bonded (TAB) devices are attached directly to the carrier and located by vision. Components attached in this manner have a somewhat limited production rate due to the time taken by the vision system. In addition TAB components often have a need to be singulated, that is, handled separately rather than on a reel.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Frame-Mounted TAB Component

       At present Tape Automated Bonded (TAB) devices are
attached directly to the carrier and located by vision. Components
attached in this manner have a somewhat limited production rate due
to the time taken by the vision system. In addition TAB components
often have a need to be singulated, that is, handled separately
rather than on a reel.

      A solution to these problems is to provide a carrier, shaped
like a small picture frame which has locating pins which quickly and
accurately locate the component. The normal TAB component would have
the web extended beyond the outer lead bond so as to provide an area
for adhering the component to the frame with adhesive. The component
would be removed from its flexible carrier and adhered to the frame.
The frame would provide the following features:
      1.   protection of the components from damage before and after
attachment,
      2.   a carrier for singulated components,
      3.   a base for a protective cover or a heat sink,
      4.   use as a guide in the Outer Lead Bonding process, and
      5.   use as a dam for potting compound to protect the TAB
component.