Browse Prior Art Database

Conductive Glue Repair of TAB Assemblies

IP.com Disclosure Number: IPCOM000099979D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 1 page(s) / 33K

Publishing Venue

IBM

Related People

Gruber, HW: AUTHOR [+3]

Abstract

TAB (tape automated bonding) wires that do not stick to the integrated circuit (IC) chip pad or that are broken between the polyimide film and the IC pad are glued together with a high-conductivity glue. The two ends of the open are mechanically aligned in a face-to-face position. A dispenser applies a drop of glue to this interface for fixing the positioned wire ends or wire to the pad interface. A hot gas stream cures the conductive glue to a rigid interface to provide an electrically and mechanically reliable connection. A useful glue or adhesive is a silver-filled polyimide adhesive with a resistivity of 1 mL/cm, a factor 6 larger than copper.

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Conductive Glue Repair of TAB Assemblies

       TAB (tape automated bonding) wires that do not stick to
the integrated circuit (IC) chip pad or that are broken between the
polyimide film and the IC pad are glued together with a
high-conductivity glue.  The two ends of the open are mechanically
aligned in a face-to-face position.  A dispenser applies a drop of
glue to this interface for fixing the positioned wire ends or wire to
the pad interface.  A hot gas stream cures the conductive glue to a
rigid interface to provide an electrically and mechanically reliable
connection.  A useful glue or adhesive is a silver-filled polyimide
adhesive with a resistivity of 1 mL/cm, a factor 6 larger than
copper.