Browse Prior Art Database

Memory Wire Chip Removal Fixture

IP.com Disclosure Number: IPCOM000099994D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2005-Mar-15
Document File: 1 page(s) / 36K

Publishing Venue

IBM

Related People

Gruber, HW: AUTHOR [+4]

Abstract

A fixture is disclosed that applies memory wire for non-desctructively removing a chip from a substrate. The memory wire resumes its original shape when subjected to heat. The memory wire is attached to the chip which is soldered to the substrate by C4. The fixture assembly is fed through the chip joining oven which does two things: it melts the C4 balls and causes the bent memory wire to slowly return to a straight shape. This slow action exerts a pull on the chip, lifting it smoothly off the substrate. The fixture requires only three components (see figure): the memory wire, a clamp for attaching the memory wire to the chip, and a support for the substrate which also holds the memory wire to provide the chip lift-off support.

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Memory Wire Chip Removal Fixture

       A fixture is disclosed that applies memory wire for
non-desctructively removing a chip from a substrate.  The memory wire
resumes its original shape when subjected to heat.  The memory wire
is attached to the chip which is soldered to the substrate by C4.
The fixture assembly is fed through the chip joining oven which does
two things: it melts the C4 balls and causes the bent memory wire to
slowly return to a straight shape.  This slow action exerts a pull on
the chip, lifting it smoothly off the substrate.  The fixture
requires only three components (see figure): the memory wire, a clamp
for attaching the memory wire to the chip, and a support for the
substrate which also holds the memory wire to provide the chip
lift-off support.